Design of Electronic Assemblies on Printed Circuit Boards

A 2011 KPI course text that supplies a useful end-to-end map of printed-board realization, but whose prescriptive dimensions and standards must be replaced by current IPC documents and fabricator capabilities.

book Design of Electronic Assemblies on Printed Circuit Boards Yurchuk, L. Yu. · 2011 archived pdf

The course treats a printed board as an engineered assembly rather than a drawing exercise. Its durable contribution is the sequence connecting requirements, schematic analysis, part and connector choices, construction class, board material and fabrication method, mechanical definition, placement, routing, checks, and release documentation. That sequence seeded the Electronics Design & Manufacturing territory.

What carries forward #

  • A board must be designed together with its enclosure, connectors, manufacturing process, test strategy, and service constraints.
  • Placement is a functional partitioning problem. Routing quality is largely determined before the first trace is drawn.
  • Current, voltage, thermal behavior, tolerances, and production capability are design inputs, not last-minute rule checks.
  • The released product is a controlled package of fabrication, assembly, and inspection information, not merely the editable CAD database.

The text also gives a coherent vocabulary for rigid boards, layers, conductors, plated holes, mounting, component orientation, and documentation. Those mechanisms remain useful, while the exact dimensional recipes do not.

Present-day reconciliation #

The book predates current IPC revisions and reflects Soviet and early post-Soviet design-documentation practice. Its fixed conductor-width tables, clearance rules, package assumptions, and references to older IPC revisions are therefore not used as current requirements. The GTK entries instead separate four authorities:

  1. the governing product and safety standards;
  2. current IPC design and acceptance documents;
  3. the selected component manufacturers' land-pattern and application data;
  4. the actual fabricator and assembler capability profile.

This is more than a standards update. A numeric rule is meaningful only when its conditions are known: copper thickness, allowable temperature rise, altitude, pollution degree, voltage waveform, solder process, inspection class, and process capability all change the answer.

Visual audit #

All 127 rendered pages were inspected. The information-bearing visuals include the design-flow diagram, example board constructions, package and mounting sketches, placement grids, routing examples, conductor geometries, and legacy drawing forms. They are legible enough to identify the concepts but are closely tied to outdated rules and documentation conventions. None is retained as an entry asset. The durable relationships are rebuilt as independent, theme-aware diagrams and tables verified against current primary sources.

Limits #

This is an authored course text, not a primary fabrication or safety specification. It is strongest as a map of the work and weakest where it prescribes present-day values. It should not be used to release a board without current standards, component data, and supplier review.

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